Electrical/Electronic (E/E) architectures are key to enabling increased levels of autonomy in the next generation of smarter connected vehicles. The custom silicon solutions that many OEMs are adopting for ADAS functionality bring design complexity, a need to balance compute needs with a stringent power budget envelope, and the pressure to meet aggressive time-to-market expectations. The traditional silicon foundry model has evolved to offer more resources to OEM partners—gone are the days when the foundry is simply a silicon manufacturing partner. Working with ecosystem partners, Foundries now provide end-to-end solutions, including expert market consultation, design execution, wafer manufacturing, packaging and module building, and memory solutions. Similarly, SoC design has evolved beyond monolithic single-chip designs to full chiplet-based solutions that address an OEM’s need for silicon customization and the ever-increasing compute demands in the physical AI era. The objective is to deliver chiplet-based architectures that offer cost efficiency, customization, configurability, and a flexible engagement model built upon the foundation of a rich EDA, IP development, and design services ecosystem.
During this presentation, Samsung Foundry and Cadence will share examples of how we have enabled our automotive customers to realize their ideas into silicon with the help of our ecosystem partners.